200G/400G Ethernet NIC (non-accelerated)

200G/400G 以太网网卡 · Optics & cabling

classify firstHS 8517.62per cardCN supply: moderate

5A991/5A992 depending on crypto. Distinguish from BlueField-class DPUs, which are .z candidates.

What Qing asks

One dense message. Five is the whole budget per supplier reply, so the questions that decide comparability go first.

70
Decides comparability — a quote missing these cannot be ranked
  1. 1.

    机箱用的是SGCC还是SECC钢板?主体和面板分别多厚(0.8mm、1.0mm还是1.2mm)?表面处理是电镀锌、喷粉还是烤漆?空机箱净重多少公斤?

    SGCC or SECC steel, what thickness for body and front panel (0.8/1.0/1.2 mm), what surface finish (electro-zinc, powder coat, paint), and what is the empty chassis weight in kg?

    Missing from the report despite chassis being its designated high-margin entry lane. Gauge is what separates a cheap chassis from a rigid one, and it is directly checkable on receipt.

  2. 2.

    我们付了模具费(NRE)之后,模具的所有权归谁?模具寿命多少万模次?后续能不能把模具转移到别家工厂?模具保管和维护费用怎么算?

    After we pay the NRE, who owns the tooling, what is its rated life in shots, can it be transferred to another factory, and who pays storage and maintenance?

    The classic China custom-mechanical trap. Paying for a mould you do not own converts a commodity part into a sole-source part.

  3. 3.

    风扇在多少英寸水柱静压下能达到多少CFM风量?不要只给自由风量。风扇是哪家、什么型号?整机的风墙总风量是多少?噪音多少分贝?

    What is fan airflow in CFM at a stated static pressure (inH2O) — not free-air CFM? Which fan vendor and part number, what is total fan-wall airflow, and what is the noise level in dBA?

    The report puts this in a note but never turns it into a field. Free-air CFM is meaningless behind a populated GPU chassis.

  4. 4.

    这个准系统报价具体含哪些:机箱、主板、背板、风扇模组、电源、导风罩、线缆、导轨、硬盘托架各含不含?不含的部分单价分别是多少?

    Itemise what the barebone includes and excludes: chassis, motherboard, backplane, fan modules, PSUs, air duct, internal cables, rails, drive carriers. Price each excluded item separately.

    'Barebone' means different things at every factory. Without this, two barebone quotes differ by 30% for reasons nobody can see.

  5. 5.

    端口速率和数量是多少(如 2×25G SFP28、2×100G QSFP28、1×400G OSFP)?是否支持降速运行?

    Port speed and count (e.g. 2x25G SFP28, 2x100G QSFP28, 1x400G OSFP)? Does it support running at lower speeds?

    Baseline comparability field

  6. 6.

    主控芯片的完整型号是什么(如 MCX623106AN-CDAT、Intel E810-CAM2)?能否提供芯片丝印照片?

    Full controller part number (e.g. MCX623106AN-CDAT, Intel E810-CAM2)? Can you send photos of the chip markings?

    Marketing names hide sub-variants with different offload capability; chip photos also expose relabelled fakes

  7. 7.

    主机接口是 PCIe 几代、几通道(Gen3 x8 / Gen4 x16 / Gen5 x16)?在我方服务器上能否跑满标称带宽?

    Host interface generation and width (PCIe Gen3 x8 / Gen4 x16 / Gen5 x16)? Will it reach rated bandwidth in our server?

    The most common silent downgrade: the right ports on the wrong bus

  8. 8.

    板卡形态是标准 PCIe(半高/全高、半长/全长)、OCP 3.0 SFF、OCP 2.0 还是某 OEM 的 rNDC/FlexLOM 子卡?

    Form factor: standard PCIe (HHHL/FHHL), OCP 3.0 SFF, OCP 2.0, or an OEM rNDC/FlexLOM daughter card?

    OCP and rNDC cards are chassis-specific and not resellable across platforms

  9. 9.

    固件是原厂通用版还是 OEM 定制(戴尔/HPE/联想)?PSID 是什么?能否刷成通用固件?在非同品牌服务器上是否会报未授权设备?

    Is the firmware generic vendor firmware or OEM-branded (Dell/HPE/Lenovo)? What is the PSID? Can it be cross-flashed to generic? Will a non-matching server flag it as unauthorised?

    OEM-locked cards are cheaper for a reason and may refuse to initialise in another vendor's server

  10. 10.

    支持哪些卸载:RoCEv2、SR-IOV(最大 VF 数量)、DPDK、PTP 硬件打时戳、IPsec/TLS 加解密、NVMe-oF?请提供驱动与操作系统支持矩阵。

    Which offloads: RoCEv2, SR-IOV (max VF count), DPDK, PTP hardware timestamping, IPsec/TLS crypto, NVMe-oF? Please send the driver and OS support matrix.

    Two cards at the same speed can differ by an order of magnitude here; VF count alone can decide a cloud build

  11. 11.

    货品状态是全新原封、原厂散装、拆机件、翻新件还是工程样片(ES/QS)?能否提供来源说明、原始包装和序列号可查性证明?

    Is the stock new sealed, new bulk, OEM pull, refurbished, or an engineering sample (ES/QS)? Can you evidence provenance, original packaging and serial-number verifiability?

    Engineering samples are not licensed for production use and may carry pre-release firmware; this is the field that separates real quotes from fantasies

  12. 12.

    网卡 MAC 地址属于哪家的 OUI?是否为该主控厂商正式申请的地址段?同批次是否存在重复 MAC 或重复序列号?能否提供随机抽样的 MAC 与 SN 清单供我方核验?

    Which OUI do the cards' MAC addresses belong to, and is it the controller vendor's registered block? Are there duplicate MACs or serials within a batch? Can you send a random sample of MAC/SN pairs for us to verify?

    The cheapest and most decisive anti-counterfeit test on NICs: cloned and relabelled cards routinely carry duplicated or unregistered MAC blocks, which also breaks DHCP and LACP at scale

  13. 13.

    该网卡在满负荷时要求的最小风量是多少 LFM?风向要求是前进后出还是后进前出?在我方机箱的槽位风道下是否需要额外散热片?

    Minimum airflow in LFM at full load? Required direction (front-to-back or back-to-front)? Does it need an extra heatsink in our chassis' slot airflow?

    400G and OCP 3.0 cards have hard LFM minimums; a card that meets spec in the vendor's test chassis thermally throttles or shuts down in a shallower one. Never appears on a price quote

  14. 14.

    驱动是操作系统内核自带(in-box)还是需要单独安装(out-of-tree)?支持哪些内核版本、发行版和虚拟化平台(VMware/KVM/Hyper-V)的具体版本号?该卡是否在这些平台的官方兼容性列表(HCL)中?

    Is the driver in-box in the OS kernel or an out-of-tree module? Which exact kernel versions, distributions and hypervisor versions (VMware/KVM/Hyper-V) are supported, and is the card on those platforms' official HCL?

    An out-of-tree driver is a maintenance liability for the life of the fleet; HCL absence blocks vendor support on the whole host, not just the card

  15. 15.

    出货固件基线版本是多少(BIOS/BMC/NIC/RAID逐项列出)?后续安全更新提供多少年?由谁发布、从哪个地址下载?固件是否签名?

    State the shipping firmware baseline per component (BIOS/BMC/NIC/RAID). For how many years will security updates be provided, by whom, from what URL, and is firmware signed?

    The most common whitebox gap: nobody commits to who ships the next security patch, or for how long.

  16. 16.

    贵司是否为原厂授权代理或授权分销商?如是,请提供授权书扫描件(含有效期)与代理编号。如不是,请说明上游是哪一级渠道,是否可提供上游采购凭证。

    Are you an authorised distributor or reseller for this brand? If so, send the authorisation letter with its validity dates and your account code. If not, state which tier your upstream is and whether you can show the upstream purchase document.

    Separates an authorised channel (where OEM warranty and serial registration actually exist) from open-market stock. Most sellers cannot produce this, which is itself the answer.

  17. 17.

    该型号是否在【主板型号+版本+BIOS版本】上实测通过?满配(每通道几条)时能跑到多少MT/s?请提供该平台的实测截图或兼容性列表,注明测试日期。

    Has this exact part been tested on [board model + revision + BIOS version]? At full population (how many per channel), what speed does it actually train to? Send the test screenshot or compatibility list with the test date.

    'Compatible' is not a spec. Validation is against a named board revision and a named BIOS/BMC version, at a named population density and speed.

  18. 18.

    BMC与BIOS固件是否有数字签名与安全启动?出厂默认账号密码是什么,是否每台唯一?是否能提供固件的SBOM(软件物料清单)与开源组件许可清单?固件由哪家公司编译发布?

    Are BMC and BIOS firmware digitally signed, and is secure boot enabled? What are the factory default credentials, and are they unique per unit? Can you supply an SBOM and open-source licence list for the firmware? Which company builds and publishes it?

    Whitebox BMCs commonly ship with shared default credentials, unsigned firmware and open management ports. This is the field that turns 'firmware provenance' from a sentence into a check.

Ranking inputs
  1. 19.

    随货是否同时提供半高和全高挡板?OCP 3.0 是拉手条(pull-tab)还是内部锁扣(internal lock)版本?

    Are both low-profile and full-height brackets included? For OCP 3.0, is it the pull-tab or internal-lock variant?

  2. 20.

    网卡固件与驱动是否有有效数字签名?在开启 UEFI Secure Boot 的服务器上能否正常加载?Option ROM 是否签名?

    Are the card firmware and driver validly signed? Will they load on a server with UEFI Secure Boot enabled? Is the Option ROM signed?

  3. 21.

    提供哪些认证文件:CE、FCC、UL/CB、CCC、RoHS、REACH、能效标识?是否有 MTBF 数据和第三方测试报告?激光产品是否有 Class 1 符合性声明?

    Which certifications are provided — CE, FCC, UL/CB, CCC, RoHS, REACH, energy labelling? Is there MTBF data and a third-party test report? Class 1 laser conformity declaration for optical products?

Asked on every purchase — commercial and compliance terms
  • 这批货是全新原封、官翻、拆机件还是工程样片(ES/QS)?请在形式发票上写明状态。如果是拆机件,来源和使用时长是多少?

  • 报价是EXW、FOB还是CIF?指定口岸是哪里?报价里不含哪些费用(出口报关、内陆运输、保险、目的港费用)?

  • 外箱尺寸多少?每箱装几台、毛重多少公斤?每托盘几箱?整单总体积多少立方米?是木托还是纸托、是否需要熏蒸证明?

  • 请给出阶梯报价:1台、10台、50台、100台各是什么价格?每个型号的起订量是多少?价格有效期多久?

  • 出口报关准备用哪个HS编码?报价是含税价还是不含税价?该编码的出口退税率是多少、退税是否已经体现在报价里?

  • 整机原产地写哪里?能否出具原产地证(一般CO还是Form E/RCEP优惠证)?货物是从中国直接出口,还是经香港、新加坡或越南转运?

  • 质保多少个月?DOA(到货即损)申报期限是几天?返修是寄回中国还是有海外备件?是否提供先行换货?返修运费谁承担?

  • 这个托架/导轨/面板是原厂件还是兼容件?上面有没有原厂LOGO或型号标识?能否书面保证不侵犯第三方商标和专利,并承担相关责任?

  • 整机和关键部件(CPU、加速卡、网卡)的原产地分别是哪里?产品里有没有使用美国原产的芯片、软件或技术?大概占多少比例?能不能配合签署最终用户和最终用途声明、承诺不转运?这个型号以前出口过哪些国家?

  • 合同和发票的签约主体全称是什么?统一社会信用代码是多少?工厂是自有还是代工?母公司或控股股东是谁、持股比例多少?有没有国资或上市公司背景?

  • 请提供公司全称、统一社会信用代码和营业执照复印件。贵司是生产工厂、原厂授权代理还是贸易商?如为工厂,工厂地址在哪里、可否安排验厂或视频验厂?开票主体与收款主体是否为同一家公司?

  • 最小起订量是多少?请给出阶梯报价(如100/500/1000/5000片)。报价有效期多少天?NAND和HDD价格波动时如何调价?是否接受锁价?

+ 37 more universal terms

How buyers get burned here

Category-specific, from research rather than generic advice

  • Assuming 'not US-origin' means 'not subject to the EAR'. The Advanced Computing FDPR at 734.9(h) captures foreign-produced 3A090/4A090/.z items made with listed US technology or software, or on a plant derived from it. That covers essentially all leading-edge logic on earth. De minimis analysis never even begins for an FDPR-captured item.
  • Assuming a Chinese trading company can lawfully resell a controlled accelerator abroad. It cannot: 742.6(b)(10)(iii) is presumption of denial for all reexports and for D:5/Macau-headquartered entities, and License Exception ACA at 740.8 expressly excludes entities headquartered in — or ultimately parented in — D:5 or Macau. There is no structure that fixes this.
  • Reading the January 2026 case-by-case rule as 'H200 is now sellable to China'. It permits a LICENSED US EXPORTER to apply, with four certifications including a 50%-of-US-volume cap and mandatory independent US-lab pre-export verification. It changed nothing about reexport from China, and left presumption of denial fully intact for D:5/Macau-headquartered buyers.
  • Believing the AI Diffusion Rule was rescinded and its machinery is gone. It was never rescinded in the Federal Register: 740.27 (AIA), 740.28 (ACM), 740.29 (LPP), Supplement 5 to Part 740 and the 790,000,000 TPP country allocations are all still codified at 2026-09-01. BIS announced non-enforcement of its NEW requirements in May 2025, but the 2026-05-31 guidance confirms the pre-existing November-2023 headquarters-based licence requirement IS enforced, and the 2026-06-17 FAQ extends it to .z items.
  • Treating the Affiliates Rule as dead. It is STAYED, not repealed — 2025-19846 stays the 2025-09-30 IFR until 2026-11-09, roughly two months from now. Build the 50%-ownership aggregation logic now behind a flag. Note also that FDPR footnote 5 already carries its own surviving 50%-ownership provision, and OFAC's own 50% Rule never went away.
  • Screening the brand instead of the legal entity. Entity List designations are entity-specific: 'Inspur (Beijing) Electronic Information Industry' is listed while other Inspur group companies are not, and several distinct Fudan Microelectronics entities were listed separately in September 2025. Screen the unified social credit code on the contract, plus every alias.
  • Ignoring alias sprawl. The September 2025 additions show entities with up to sixteen aliases, and the four NetForward / Nanfei entities were listed across four cities. A single-string name match will miss most of them.

Generated imagery — illustrative of the category, not a photograph of any supplier, facility or product on this platform.